electromigration

美 　英 [elektr??m?ɡ're??(?)n]

• n.電解遷移；電移
• 網(wǎng)絡(luò)電遷移；電致遷移；電遷移法

英漢解釋

n.	1. 電解遷移 2. 電移

例句

The electromigration of Cd in contaminated kaolin soil by an iron (Fe) and activated char (C) primary cell.

以鐵屑和活性炭構(gòu)建的（原）電池研究不同電極間距下高嶺土中的鎘在（原）電池電場下的電動力學(xué)遷移。

As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.

當(dāng)電流通過焊點時，會伴隨產(chǎn)生焦耳熱效應(yīng)和電遷移效應(yīng)。

The effects of annealing and nitrogen as a diluting gas on the electromigration resistance of deposited copper film were also investigated.

考察了沉積后退火以及氮氣作為稀釋氣體對沉積的銅薄膜抗電遷移率的影響。

II Abstract The electromigration of solder at solid state was studied in the past, but it was not discussed at liquid state.

I在以往焊錫的電遷移研究中，探討對象都是固態(tài)焊錫，而液態(tài)焊錫是未被探討的。

With higher current and smaller size trends, electromigration in flip-chip solder has become an critical of reliability concern.

伴隨積體電路高電流?小尺寸的設(shè)計變化，覆晶焊錫接點內(nèi)的電遷移現(xiàn)象成為元件可靠度的影響關(guān)鍵。

Having 40% lower resistivity than Al and good electromigration resistance, Cu is being considerably studied as candidate of Al.

銅的電阻率比鋁低40%，有更好的抗電遷移能力，因而被作為鋁的替代材料而受到廣泛研究。

In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration.

本論文主要研究了ULSI中銅互連線的微觀結(jié)構(gòu)和應(yīng)力及其對與電徙動MTF的影響。

Action of electromigration in the charge.

電遷移在充電中的作用。

With the development of large-scale integrated circuits, the reliability caused by electromigration becomes a key issue.

隨著大規(guī)模集成電路的不斷發(fā)展，電遷移引起的集成電路可靠性問題日益凸現(xiàn)。

So it is very necessary to study the wettability of lead-free solders and electromigration of solder joints.

因此開展低成本無鉛焊料潤濕性和焊點電遷移研究非常有必要。

On the diffusion mechanism and Its Differential Equations for the diffusion migration with Electromigration

關(guān)于擴散遷移與電致遷移共同作用時的擴散機制及微分方程

Electromigration reliability diagnosis and clock signal integrity analysis using electrothermal simulations

基于電熱模擬的電遷移可靠性診斷及時鐘完整性分析

Characterization of Al Via Electromigration in VLSI Interconnection and Its Reliability Research

互連鋁通孔電遷移特征及其可靠性研究

An investigation of high temperature and constant current electromigration reliability assessment technique

高溫恒定電流電遷移可靠性試驗及結(jié)果分析

Investigation of Indicator Parameters of Electromigration in Very Large Scale Intergration Interconnects

超大規(guī)模集成電路金屬互連線的電遷移過程指示參量研究

Quantitative study on the electromigration dispersion in capillary zone electrophoresis

毛細(xì)管電泳電遷移擴散的定量研究

Research and Development of the Cu Interconnect and Its Electromigration Failure

銅互連電遷移失效的研究與進展

Numerical Calculation of Electromigration Under Pulse Current with Joule Heating

考慮焦耳熱的脈沖直流下電遷移數(shù)值計算

Test Methods for Electromigration in IC Interconnects and Their Evaluations

集成電路互連線電遷移測試方法與評價

Electromigration in Al interconnects and the challenges in ultra-deep submicron technology

鋁互連線的電遷移問題及超深亞微米技術(shù)下的挑戰(zhàn)

Progress of Electromigration in IC Interconnect Metallic Line

集成電路互連引線電遷移的研究進展

Wafer-Level Test System of Wiring Metallization Electromigration

金屬化布線晶片級測試系統(tǒng)