scsp
美
英 
- 網(wǎng)絡(luò)服務(wù)器高速緩存同步協(xié)議(Server Cache Synchronization Protocol);堆疊芯片尺寸封裝;疊層芯片封裝
例句
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆疊芯片封裝(SCSP)器件在封裝工藝過程中的熱應(yīng)力分布。
Thermal stress analysis and fatigue life prediction for solder joint of SCSP
疊層芯片封裝元件熱應(yīng)力分析及焊點(diǎn)壽命預(yù)測(cè)