bga

美 　英

• 網(wǎng)絡球柵陣列(Ball Grid Array)；球柵陣列封裝；閘球陣列封裝

例句

The BGA program can be described as a time-contingent increase in activities from baseline toward predetermined goals.

BGA計劃可被描述為按時間將活動時間從基線提高到預定目標。

This can cause deformation of the BGA-balls when some of the material in the ball flowing into the via.

這可能會導致變形的BGA球時的一些材料在球流入通過。

The point is the basic theories studying on BGA soil activation improving seashore Saline soil in the experiment.

本試驗重點是對土壤激活劑BGA改良濱海鹽土進行最基本的理論研究。

Spur gear (SGA) or compound bevel gear (BGA) attachments can be provided in any position shown in Figure 1.

如果采用正齒輪（SGA）或復合傘齒輪（BGA）附件，則可以在圖1中顯示的各個位置安裝手輪。

This section contains the top- view illustrations and pin assignments for applicable BGA package types .

適用BGA封裝類型的項視詳圖和引腳分配。

Flexible formed BGA Repair Workstation with option preheater , working stand and soldering station.

靈活選配預熱臺，工作臺架和焊臺，可組成BGA返修系統(tǒng)。

BGA rework station development & manufacturing .

研發(fā)生產(chǎn)BGA返修臺。

Please mail me details of BGA rework station, I need BGA rework station with camera, vaccum Pump, Profile save option on computer etc.

請給我發(fā)電郵，詳細的BGA工序，我需要的BGA返修站攝像頭，真空泵，檔案保存選項電腦等。

Surface mount BGA Packaging Technology for high-speed Optoelectronic modules is described in this paper.

本文介紹了用于高速光電組件的表面安裝型焊球陣列（BGA）封裝技術。

Heating is not good, some area's temperature is not enough, or it's too late to remove the BGA.

加熱不均勻，局部地區(qū)溫度不夠或卸芯片不及時。

We provide the welding tools, repair tools, fume extraction and BGA repair center.

我們提供的產(chǎn)品主要分焊接工具，返修工具，空氣凈化系統(tǒng)和BGA專用返修站。

Must have broad experience with PCBA rework including BGA's and small SMT components (0201, etc. ).

擁有豐富的PCBA返工經(jīng)驗，包括BGA和小SMT器件的返工。

Unique a 3 segments' temperature curve program achieves a steady heat rising and good protection of BGA component.

獨設三段式溫度曲線程序，實踐分段升溫控制，令BGA得到妥貼的保護。

It is ideal for cleaning thru hole, BGA and SMT designs, and rinsing residues from connectors.

它是清潔孔洞，BGA和SMT設計的理想清潔劑，還可以清洗連接器的殘留物。

BGA problem is the appearance after reflow inspection.

BGA的問題是回流焊后的外觀檢查。

Very few operators in the BGA market have the scale to overhaul their own engines.

在公務、通用飛機市場，只有極少數(shù)的運營商擁有發(fā)動機大修能力。

Laser cut trumpet type reballing steel plate and BGA stencil helps precise positioning and easy BGA reballing .

激光刻割喇叭型植錫鋼片配合BGA定位模板，準確定位及BGA植錫更容易。

With the population of portable device, mechanical drop reliability of Ball Grid Array (BGA) Packaging becomes more and more important.

隨著便攜式電子產(chǎn)品的普及，球柵陣列（BallGridArrayBGA）封裝的跌落可靠性變得越來越重要。

That was ahead of the 816 billion euros ($1. 17 trillion) forecast for Germany by its foreign trade organization, BGA.

這一數(shù)據(jù)超過了德國自己的對外貿易機構預測的8160億歐元（1.17萬億美元）出口額。

Small component around BGA will never be removed because the temperature is lower than the melting point.

在此狀態(tài)下，焊錫尚未熔化，不會影響周邊靠得較近的元件。

Based on the idea of machine's load balance, the Balance Genetic Algorithm (BGA) for AMSF is presented.

基于機床負荷平衡的思想，提出了面向先進制造車間的平衡遺傳算法，并與傳統(tǒng)的遺傳調度算法進行了對比。

Melt the solder ball to remove the BGA.

使焊球熔化以取下芯片。

Shape Prediction of BGA Solder Joint and Its Reliability Optimization Design

BGA焊點的形態(tài)預測及可靠性優(yōu)化設計

Mechanical Test on Reliability of Lead-free BGA Assembly and Microstructure Analysis of Soldering Interface

無鉛BGA封裝可靠性的跌落試驗及焊接界面微區(qū)分析

Reliability study of BGA mixed solder joint under thermal cycle

BGA混合焊點熱循環(huán)負載下的可靠性研究

Three dimensional computer aided design for BGA semiconductor packaging machine

BGA植球機三維計算機輔助模塊化設計

BGA Enters Mainstream of the Contemporary Assembly Technology

BGA技術成為現(xiàn)代組裝技術的主流

Effect of Geometrical Nonlinearity on Warpage Prediction of Matrix Stacked Die BGA During Assembly Process

集成工藝中疊片BGA陣列翹曲的幾何非線性預測分析

Vision inspection technique and application of full-automatic BGA mounting machine

BGA全自動植球機視覺檢測技術及應用

Optical BGA Packaging Technology for high-speed Optoelectronic modules

用于高速光電組件的光焊球陣列封裝技術

A shadow moire technique by changeable light source for BGA coplanarity measurement

BGA引腳共面度的變光源陰影莫爾測量技術

Application of Infrared Heating Technology to BGA Rework Soldering Center

紅外加熱技術在BGA返修焊接中心的應用

Water-saving Mechanism and Using Ways of Organic Drought-resistance Fertilizer BGA

有機抗旱肥料BGA的節(jié)水機制及其施用技術

Causation and Improvement of Lip Effect in BGA Substrate Singulation Process

BGA基板切割過程中唇緣效應的產(chǎn)生及改進措施

BGA packaging top-view illustration and terminal assignments table, if applicable (not illustrated in Figure 1)

BGA封裝過程演示和終端分配表格，如果可采用的話（圖1為包括）

High-speed and High-precision Vision Detection and Locating Algorithm of BGA

BGA芯片的高速高精度視覺檢測與定位算法

Three-dimensional Measuring Technology for BGA Chip Leads

BGA芯片管腳三維尺寸測量技術

Formation Mechanism of BGA Void and Effects on Solder Joint Reliability

BGA空洞形成的機理及對焊點可靠性的影響

Fatigue Life Assessment of Solder Joints of BGA Component in Board Level Drop Test

BGA焊點在板級跌落實驗中的疲勞壽命估計

Mechanical Test and Analysis on the Reliability of Lead-Free BGA Packaging

無鉛BGA封裝可靠性的力學試驗與分析