reflow
美 ['ri:fl??] 
英 ['ri:fl??]
- n.軟熔焊接；頁面重排（調整文本在計算機屏幕上的顯示密度）
- v.倒流；逆流
- 網絡回流；回流焊；回焊
英漢雙解
1. | 軟熔焊接a method of joining metals together by heating and melting solder(= a soft metal mixture) |
2. | 文檔重整，頁面重排（調整文本在計算機屏幕上的顯示密度）the fact of changing text on a computer screen so that it takes more or less space |
英漢解釋
例句
applicable to different grades of welding equipment requirements, the performance of a wide reflow furnace good welding performance.
可適用不同檔次的焊接設備要求，在較寬的回流焊爐內表現良好的焊接性能。
If these types of defects are caught pre-reflow, the component can be reused in most cases, while post-reflow it must be scrapped .
如果再流前發現這類缺陷，多數情況下這類元器件還能使用，而再流后發現，這類元器件就必須替換。
Solder Balling is recognized by numerous tiny solder balls trapped along the peripheral edge of the flux residue after reflow.
產品回焊后在殘留的助焊劑周邊會有大量小的錫球。
Kester proudly announces that it has been awarded a patent for its Reflow Encapsulant technology including material and method of use.
凱斯特驕傲地宣布，它已獲得回流密封劑技術（其中包括材料和使用方法）的專利。
The extending portion is electrically connected by being reflow soldered to a land at a reverse surface of the substrate.
所述延伸部通過回流焊接與在基板背面的接合部電連接。
Exceptionally long printing service, and the residues after reflow appear to be transparent.
印刷壽命特長，回流后殘留物呈透明狀。
The mechanism of no-reflow phenomenon, the progress in various therapies of improving microcirculation, and existent problems are reviewed.
現對無復流現象的機制及各種改善心肌微循環治療的研究進展及存在問題作一綜述。
Tombstone phenomenon results from unbalance of solder surface tension on two pads of component soldering terminal during reflow soldering.
“豎碑”現象是元件兩端焊盤上的焊膏在回流熔化時對元件兩個焊接端的表面張力不平衡所致。
and allowing the chip and the substrate to pass through a reflow furnace together so that the chip and the substrate are closely combined.
及將所述芯片與所述基板共同過回焊爐，從而使二者緊密結合。
Control can resize or reflow its child controls as the dimensions of the parent form change .
控件可以調整其子控件的大小和流動。
A general profile setting up a wave solder machine to optimize reflow using an alcohol base flux.
一種常規溫度特性曲線，用于對波焊機進行設置，對采用以酒精為基本成分的焊劑回流進行優化。
What other issues can be expected with the conversion to lead-free reflow soldering?
轉變到無鉛回流焊接還會遇到什么問題？
The three different solder pads may each require a slightly different temperature for a simultaneous reflow.
三種不同的焊盤可能需要為同時回流溫度略有不同。
The article reviews progress in research into pathogenesis, diagnosis of coronary no-reflow phenomenon.
現對無再流現象的發病機制及診斷的研究進展進行綜述。
The progresses and the existent problems in prevention and treatment of coronary no-reflow phenomenon following PCI are reviewed.
本文主要對PCI后無再流現象的預防和治療進展及存在問題進行綜述。
In the end, PLC and temperature sensors are used to complete the reflow soldering temperature control and detection.
采用PLC和溫度傳感器完成對回流焊溫度的現場檢測和控制，達到了工藝要求。
Voluntary voiding function, maximum reflow rate and residual urine volume were used as observation indices.
觀察指標為自主排尿能力、最大尿流率和殘余尿。
The product has good heat durability that withstands lead-free compatible reflow soldering conditions.
符合無鉛化回流焊接條件，具有耐高溫性。
Conclusions: Intracoronary administration of tirofiban is effective and safe for ACS patients with no reflow phenomenon after PCI.
結論：冠狀動脈內注射國產鹽酸替羅非班治療ACS介入術后無復流患者是有效和安全的。
Lead- free wave soldering, wave soldering wave peak welding machines, reflow soldering machine .
無鉛波峰焊，波波峰焊，峰焊接機，回流焊接機。
Does the product Temperature Profile meet the reflow requirements for the SMT components according to the component manufactures?
產品的溫度曲線是否符合零件制造商提供的SMT零件回流焊要求？。
During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure.
在下一個回流工序，錫膏浸潤焊盤表面，形成一個固態錫膏凸起。
Prevent disease form changing: prevent qi-collateral and blood-collateral, prevent non-reflow after treatment and reoccur after recovery.
既病防變：防止氣絡及血絡、防止治療后無復流、愈后復發。
Will the higher temperatures needed for melting lead-free solder create more fumes and condensate in the reflow oven?
熔化無鉛焊料所需的高溫是否會在回流爐中產生較多的煙霧和冷凝物？
Voiding behavior of QFN is similar to typical SMT voiding and increases with pad oxidation and further reflow.
QFN排尿行為類似于典型SMT排尿和隨焊墊和進一步氧化。
This process is known as a reflow.
這個過程被稱作重排版。
Good reliability with IR-reflow soldering compared to wave soldering for through hole devices.
與插件器件相比，使用紅外回流焊具有更好的可靠性與插件器件相比，
Surface Mount Component Reflow repair on various substrate materials.
表面貼裝元件回流可修復不同襯底材料。
As mentioned earlier, a reflow is needed whenever layout and geometry change. This happens when.
正如前面所提到的，當布局和幾何改變時需要重排版。在下述情況中會發生重排版。
This paper describes newly technology trend of component mounter and green technology of ductless reflow furnance.
概述了元件安裝機的最新技術動向和無通風管道再流焊爐綠色技術。
Fine pitch solder joints are hand reworked to eliminate solder paste reflow bridges.
手工返工是為了消除細節距焊點處的再流焊橋連？
Maintain reflow and spray coating machine(PVA650) regularly, and study&improve correlative craft.
回流焊及PVA噴漆覆膜生產線的設備維護及保養，工藝改進。
A potential reflow method-laser reflow soldering was expatiated in detail.
著重闡述了一種極具潛力的再流焊方法———激光再流焊。
What happens to no-clean flux residues at the higher reflow temperatures?
較高的回流溫度會對免清洗焊劑的殘留物造成怎樣的影響？
BGA problem is the appearance after reflow inspection.
BGA的問題是回流焊后的外觀檢查。
Soldering methods: Pb-Free reflow soldering?
焊接方法：無鉛回流焊
Number is the paste I use a lot of RTS reflow profile when voids, but by PCB treatment can reduce these voids.
編號為工的錫膏在使用RTS回流曲線時有很多空洞，但通過PCB處理可以減少這些空洞。
Should a nitrogen atmosphere be used in the reflow process?
回流工藝中是否應使用氮氣？
Profile ramp up is too fast : Optimize reflow profile.
回流曲線升溫速度過快：優化回流曲線。
Suitable reflow and wave soldering.
適合于回流焊和波峰焊·
