solderable

solderable

美 ['s?ld?r?b?l] 　英 ['s?ld?r?bl]

• adj.可焊的
• 網絡可軟焊；焊接能力；可焊接

英漢解釋

adj.

1. 可焊的

例句

A uniform , compact , bright and excellent solderable coating with good adhesion was obtained by the experimental electroplating.

經小槽電鍍，獲得外觀致密均勻、似鏡面光亮、結合力強、具有優良的可焊性鍍層。

The bath components and the operating conditions for a new electroplating technology of solderable bright Sn-Bi alloy were studied.

研究了一種可焊性光亮錫鉍合金電鍍工藝的鍍液配方和電鍍操作條件；

Electroless nickel under immersion gold (ENIG) provides a solderable coating , but is expensive .

浸金下無電鍍鎳（ENIG）涂層可以提高可焊性，但此方法比較昂貴。

Develop: The unexposed PISM is developed away, leaving the solderable pads exposed.

顯影：未曝光的部分阻焊膜顯影時除去，已曝光部分留存。

Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 155, with a bonding layer

特種繞組線規范.155級帶粘結層的可焊接聚氨酯漆包圓銅線

Electroplating processes of solderable coatings from methanesulfonate bath

甲基磺酸鹽鍍液體系可焊性合金鍍層的工藝

Surfaces of dense ceramic components for electrical engineering; testing of hard-solderable metal coatings

電工細陶瓷件的表面.可硬釬焊金屬鍍層的試驗

Surfaces of dense ceramic components for electrical engineering; testing of soft-solderable metal coatings

電工細陶瓷件的表面.可軟釬焊金屬鍍層的試驗

Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 155

特種繞組線規范.155級可焊接聚氨酯漆包圓銅線

Specifications for particular types of winding wires - Solderable polyurethane enamelled round copper wire, class 180

繞組線特殊類型規范.可焊接的聚氨酯漆包圓銅線.180級

Standard Test Method for Measuring Adhesion Strength of Solderable Films to Substrates

測量可焊膜與基片的粘結強度的方法

Specifications for particular types of winding wires - Solderable polyesterimide enamelled round copper wire, class 180

特種繞組線規范.180級可焊接聚酰胺酯漆包圓銅線

Specifications for particular types of winding wires - Part 51: Solderable polyurethane enamelled round copper wire, class 180

特種繞組線規范。第51部分：釬焊聚氨酯漆包圓銅線180級

Review and Prospect of Solderable Tin-Based Binary Alloy Plating

可焊性錫基二元合金鍍層研究的現狀與展望

Research and Progress of Lead-free Solderable Tin-Based Coating

無鉛可焊性錫基鍍層的研究與發展

Developing Status of Solderable Sn Alloy Plating

電鍍可焊性錫合金工藝的發展現狀

Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155; Amendment 2

特種繞組線規范。第20部分：可焊接的聚氨基甲酸乙酯漆包圓銅繞組線，155級。修改件2

Review of tin and solderable tin alloy electroplating

電鍍錫和可焊性錫合金發展概況

Progress of research on electroless plating of solderable tin alloy

化學鍍可焊性錫基合金的研究進展

Talk on Plating Process of Solderable Bright Sn-Ce Alloy

淺談可焊性光亮錫鈰合金電鍍工藝