bonder
美 ['bɑnd?] 
英 ['bɑnd?]
- n.壓焊機；焊接器；〔建〕束石；丁磚
- 網絡見證人；接合劑；接合機
詞形變化
復數：bonders
英漢解釋
英英解釋
例句
"Certainly, Narcissa, I shall make the Unbreakable Vow, " he said quietly. "Perhaps your sister will consent to be our Bonder. "
“當然，納西莎，我可以立一個牢不可破的誓言，”他輕聲說，“也許你姐姐同意做我們的見證人。”
Experimental results can be used to model a real ultrasonic bonder and optimize its functions.
這些均有助于鍵合機換能系統的工藝建模和優化。
Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.
鍵合是IC元件生產的重要封裝過程或工序，需要在芯片鍵合機上完成。
Laugh is no bonder, no estrangement, no limits in relate to value, no difference between wealth and poverty.
笑無國界，無信仰隔閡，無價值關的界限，無貧賤之分。
This paper introduces the original structure and principle of the bond head device for high speed die bonder designed by author.
本文介紹作者設計的高速芯片焊接機焊頭的獨特結構和工作原理，并給出了主要設計參數和計算公式。
Beautiful and rich Xishuangbanna is like a brilliant pearl inlaid in the southwest bonder of China.
美麗、富饒的西雙版納猶如一顆璀璨的明珠鑲嵌在中國的西南邊疆。
AIM To investigate effects of the bonder on the bond characteristic of porcelain and cast titanium.
目的觀察粘結劑對鈦瓷結合性能的影響。
The device can replace the manual machine, and provide an additional equipment of varies die bonder.
該裝置可取代手動裝置，為各種粘片機提供配套設備。
The sheet is then passed through a thermal bonder (290) to thermally bond the reinforcement glass fibers and resin.
然后使片材通過熱粘合機（290），以便熱粘合增強玻璃纖維和樹脂纖維。
Increasing the stability of enzyme bonder effectively, decreasing its reactive setting at the same time, improving detecting sensitivity.
有效地增加了酶結合物的穩定性，同時也降低了反應背景，提高了檢測的靈敏度。
This product design for IC assembly die attache process on die bonder machine.
本產品為IC集成電路封裝工藝芯片全自動固晶機上而專門設計。
The auto Die Bonder for SOT-23 transistor is a high-speed, high-precision, machinery-electronics integrated equipment.
SOT-23晶體管封裝自動鍵合機是高速、高精度機電一體化精密設備。
Finally, the slave bonder attaches the connecting bonds based on the computed correct bond locations.
最后從屬焊接機基于正確的焊接位置附上連接粘合劑。
Under the condition, how to develop the bonder areas is a serious question to be answered.
在這樣的背景下，保稅區如何進一步健康發展已經成為需要認真思考和回答的問題。
Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.
基于解析模型的方法，研究了超聲波在熱超聲金絲球引線鍵合機變幅桿中的傳遞規律。
Industry: Electronics manufacturing equipment; Bonder; Pressure Welder; Other electronics manufacturing equipment;
所屬行業：電子產品制造設備；邦定機；壓焊機；其他電子產品制造設備；；
Industry: Other industry-specific equipment; Welding Equipment and Materials; Electronics manufacturing equipment; Bonding process; Bonder;
所屬行業：其他行業專用設備；焊接設備與材料；電子產品制造設備；邦定加工；邦定機；；
Industry: Electronics manufacturing equipment; Bonder; Wire binders; Dispensing Equipment;
所屬行業：電子產品制造設備；邦定機；焊線機；點膠設備；；
Preparation and Application of Epoxy Resin Bonder Made of Optical Thin Slice of Coal Macerals
環氧樹脂煤巖光片黏結劑的制備與應用
Industry: Reflow soldering machine; Mounter; Bonder; Electronic Components Molding Machine; Roll welding; Sealing Machine;
所屬行業：回流焊接機；貼片機；邦定機；電子元件成型機；滾焊機；打膠機；；
Industry: Mounter; Bonder; Winding machines, stranding machines; Dispensing Equipment; Hot Press; Vibration plate;
所屬行業：貼片機；邦定機；繞線機、絞線機；點膠設備；熱壓機；振動盤；；
Industry: Dispensing Equipment; Bonder; Mounter; Sealing Machine; Soldering Machine; Spot welder;
所屬行業：點膠設備；邦定機；貼片機；打膠機；焊錫機；點焊機；；
Relationship Between the Quality of Rural Population and Peasants'Income in Shaan-Gan-Ning Bonder Area
陜甘寧老區農村人口素質與農民經濟收入關系分析
A Real Time Multiple Targets Recognition Algorithm In The Full Automatic Die Bonder
全自動共晶粘片機實時多目標識別的實現
Industry: Bonder; Reflow soldering machine; Mounter; Tin melting furnace; Industrial oven;
所屬行業：邦定機；回流焊接機；貼片機；熔錫爐；工業烤箱；；
Industry: Pressure Welder; Soldering Machine; Hot Press; Crimping machine; Bonder;
所屬行業：壓焊機；焊錫機；熱壓機；壓接機；邦定機；；
Industry: Bonder; Mounter; Sealing Machine; Reflow soldering machine;
所屬行業：邦定機；貼片機；打膠機；回流焊接機；；
Performance Calculation of Servo Motor and Motion Control Technology About Wafer Stage in High-speed Die Bonder
高速粘片機晶片工作臺的電機選型計算與運動控制
Dynamic Characteristics Analysis of the Horn System with the Wire-clamp in Wire Bonder
帶線夾變幅桿系統的動態特性分析
Research and Development of the New Generation High Performance Cellulose-based Bonder
新一代纖維素基高性能黏合劑的研究和發展
Interpreter of Multitasking Framework of Automatic Die Bonder
基于上芯機控制平臺的多線程解釋器
Application of image recognition technology in the fully automatic COG bonder
圖像識別技術在全自動COG壓接機中的應用
Application of Linear Motor: Picking and Placement Mechanism in High-speed Die Bonder
線性電機在高速粘片機芯片拾放機構中的應用
Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder
鍵合機中超聲波的基本控制原理及方法
A Chip Image Recognition Algorithm in the Full Automatic Aluminum Wire Bonder
全自動超聲波鋁絲焊機中的芯片識別算法
Design of the Pneumatic and Vacuum System for High Speed Die Bonder
高速芯片焊接機的氣動及真空系統設計
A Study On The Movement Control Technology of Die Picking Mechanism of LED die Bonder
LED粘片機芯片拾取機構運動控制技術研究
Multiobjective Image Recognition Algorithm in the Fully Automatic Chip Bonder
全自動芯片鍵合機中多目標圖像識別算法
Bonder enhances bond character of porcelain and titanium
粘結劑對鈦瓷結合性能的影響
Synthesis of Novel Thermoplastic Energetic Bonder Intermediate Based on Novel Cellulose
纖維素基新型熱塑性含能粘合劑中間體合成
