wafer
美 [?we?f?r] 
英 [?we?f?(r)]
- n.薄片；威化餅；圣餅；圣體
- v.用膠紙封
- 網絡晶圓；晶片；圓片
詞形變化
復數：wafers
英漢雙解
1. | 威化餅，薄脆餅（常與冰淇淋同吃）a thin crisp light biscuit/cookie, often eaten with ice cream |
2. | 圣餅；圣體；面餅a very thin round piece of special bread given by the priest during Communion |
3. | ~ (of sth) 薄片a very thin piece of sth |
英漢解釋
n. | 1. 薄脆餅;薄餅一樣的東西;【無線,物】圓片;薄片;晶片;【醫】糯米紙 |
v. | |
英英解釋
例句
The invention relates to a radiator fan, which comprises a fan frame, an inner rotor motor, at least an impeller and a circuit wafer.
一種散熱風扇，其包含一個扇框、一個內轉子馬達、至少一個葉輪及一個電路板。
Virgin Test Wafer- A wafer that has not been used in manufacturing or other processes.
原始測試晶圓片-還沒有用于生產或其他流程中的晶圓片。
And a Y-type waveguide coupler on silicon-on-insulator(SOI)wafer used for an Intergrated optoelectronic Model was designed.
設計了一種Y型SOI波導耦合器，用于光纖陀螺光收發模塊。
The sub-threshold current test, which is often done at the wafer level, is a measure of how quickly the device will turn on and off.
亞閾區電流測試常常在晶圓片級進行。它是表示器件打開和關閉的快慢程度的參數。
A small disk or wafer of wax, lead, or paper bearing such an imprint and affixed to a document to prove authenticity or to secure it.
封緘上有印章的圓形的小蠟片、鉛片或紙片，附在文件后用來證明權威或保證文件的安全。
Egyptian priests practiced "transubstantiation" , claiming to be able to transfer the sun god Osiris into a circular wafer.
古埃及祭司也有“圣餐儀式”，他們聲稱能夠把太陽神奧西里斯轉化到一個圓形的薄餅里。
I went into a clean room with a fresh silicon wafer, and then I just cranked away at all the big machines for about 100 hours.
我在無菌室操作一片硅晶片，接著我周轉于所有這些大型機器中大約100個小時。
The great game of short-term borrowing, used to purchase longer-term and risky assets, on wafer-thin equity, would be ruled out.
憑借微薄的股本借入短期資金用于購買較長期限高風險資產的游戲將不復存在。
Chip: The individual circuit or component of a silicon wafer, the leadless form of an electronic component.
芯片：單回路或元件的硅晶元，無引腳的電子元件。
The method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate.
一種用于形成用于將焊料轉移到晶片的焊料模的方法包括將多個焊料腔蝕刻到基板中。
Area Contamination - Any foreign particles or material that are found on the surface of a wafer.
沾污區域-任何在晶圓片表面的外來粒子或物質。
Contamination Particulate - Particles found on the surface of a silicon wafer.
沾污顆粒-晶圓片表面上的顆粒。
The invention is capable of forming an even spread source coat on the surface of the wafer.
本發明能夠在晶片表面形成均勻的擴散源涂層。
The surface grinding temperature of the silicon wafer ground by diamond wheels is studied.
研究金剛石砂輪磨削單晶硅片時的表面磨削溫度。
Alternatively, coating the wafer with a nanotube-containing solvent by spinning the disk like a phonograph record also had its problems.
而要是使晶圓像留聲機唱盤那樣旋轉，讓含有奈米碳管的溶劑附著在晶圓表面，也還是有問題。
The peripheral portion of the wafer-mounting portion may be formed as a detachable graphite member covered with silicon carbide.
又，載置上述晶片的部分的周邊部也可以是自由分離的碳化硅包覆石墨材料。
Extremely wet sticky glutinous rice flour, a small group had to hand-pulling the wet surface, extruded into a wafer shape.
濕糯米粉粘性極強，只好用手揪一小團濕面，擠壓成圓片形狀。
At least once within the past year, Cree executives decided against moving wafer-making outside the U. S.
在過去一年，Cree管理層至少曾有一次反對把芯片的生產轉移到美國以外。
Ophthalmic surgical blades (734) are manufactured from either a crystalline or polycrystalline material, preferably in the form of a wafer.
眼科手術刀片（734）是用優選為晶片形式的結晶或多晶材料制造的。
Waviness - Widely spaced imperfections on the surface of a wafer.
波紋-晶圓片表面經常出現的缺陷。
Minimal Conditions or Dimensions - The allowable conditions for determining whether or not a wafer is considered acceptable.
最小條件或方向-確定晶圓片是否合格的允許條件。
However, due to manufacturing variances, the frequency response of the FBAR devices may vary slightly across the wafer.
然而，由于制造偏差，FBAR器件的頻率響應在晶圓上可能略微改變。
The differential microphone is formed using silicon fabrication techniques applied only to a single, front face of a silicon wafer.
該差動式傳聲器是通過將硅制造技術僅應用到硅片的一個單獨的前面上而形成的。
Mounting of the LCD driver wafer on the PCB with gold wires used to connect it to other circuits. It is covered with epoxy.
在PCB上LCD維夫餅乾的安裝用過去常常把它和其他電路連結起來的金電線。它被蓋住由于環氧。
Disclosed are embodiments of a wafer that incorporates fill structures with varying configurations to provide uniform reflectance.
公開了用于器件特定填充以提高退火均勻性的結構和方法。
The empty area includes an area around the wafer and a cut area for dividing the adjacent ICs.
這種未占用的區域包括晶片周邊的區域和將鄰近的集成電路分開的切口區。
Waves - Curves and contours found on the surface of the wafer that can be seen by the naked eye.
波浪-晶圓片表面通過肉眼能發現的彎曲和曲線。
The final Ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.
按照順序從每一塊掩膜版上將圖形一層一層地轉移到硅片的表面，就制得了成品集成電路。
Electrochemical wafer processing tools are often configured with several different types of chambers to support a processing sequence.
處理工具的電化學的維夫餅干經常用幾類不同的寢室成形支持一個處理序列。
The results show that it is feasibility to simulate the wear and interaction of a nano-particle of the CMP on the wafer with AFM.
結果表明：采用AFM探針來模擬CMP過程中單個磨粒對芯片表面的磨損與相互作用的試驗方案是完全可行的；
The wafer producer noted that the expansions were to keep pace with tier-one customers' expansion requests.
硅片生產商也聲稱這次擴產也是滿足廣大客戶商對硅片的不斷增長的需求。
This one looks rather like a sponge: thousands of parallel channels perforate a thin wafer of silicon.
這個棘齒看起來比較像紗布：數以千計的平行孔道貫穿一片薄薄的矽晶圓。
Deposition of nanotubes onto the wafer using a gas vapor required temperatures so high that the circuitry already in place would be ruined.
如要利用蒸氣將奈米碳管建構在晶圓上，則需很高的溫度，但這樣一來，原來的電路就會毀壞。
The slicing method of the invention is capable of implementing high area utilization efficiency of the photovoltaic wafer.
本發明的切片方法，可以實現更高的光伏晶片的面積利用效率。
The invention relates to a wafer-level lens module and a manufacturing method thereof.
一種晶圓級鏡頭模組及其制造方法。
Researchers view each hair-thin wafer of brain tissue under a microscope outfitted with a laser for precision dissection.
研究者使用裝備有精密測量激光的顯微鏡來觀察每個稀薄的大腦組織晶片。
and a plurality of column holes are formed in the silicon wafer platform for leading the telescopic vacuum columns to penetrate through.
硅片臺內設有若干柱孔，供可伸縮真空柱貫穿其中。
The silicon wafer comprises a silicon substrate, an insulating layer, at least one electric element and at least one perforating hole.
該硅晶片包括硅基材、絕緣層、至少一電性元件及至少一穿導孔。
The invention provides a silicon wafer cross-connecting device and a silicon wafer cross-connecting method thereof.
本發明提供了一種硅片交接裝置及其硅片交接方法。
A number of companies around the world are developing or have begun offering devices processed and packaged in the wafer format.
世界上許多公司都正在發展或者已經開始提供具有晶園級封裝和工藝的半導體器件。
